Modification in Heat Sink Design to Improve its Heat Dissipation Capacity for Current CPU Design

Abstract

Abstract

Electronic equipment plays an important role in day-to-day life. Almost every object or equipment or machine uses electronic components to complete its task. For electronic component to work it needs electric current to flow through the circuits. And hence they become main reason of excessive heating. Continued shrinking of electronic systems has resulted in a histrionic increase in the amount of heat generated per unit volume. Air cooling with the help of heat sinks is the most economical & efficient method of electronics cooling. In this study, thermal analysis of a server system is proposed, and an effort is made to lower the maximum temperature in the CPUs by changing CPU heat sink design. The server computer of form factor SSI EEB is modelled in detail and is analyzed by using commercial computational fluid dynamics (CFD) software packages Icepak and Fluent. To optimize parameters of heat, sink parameters the CFD simulations will be performed for maximum dissipation of heat. Few iterations will be performed by changing geometry and material of heat sinks number of fins of heat sinks and changing the fan positions on computer chassis. The optimum grouping of parameters and results will be compared with the commercially available heat sink.

Keywords: Computational fluid dynamics (CFD), CPU heat sink, icepak, electronics cooling, temperature distribution

Cite this Article

Snehal Saste, Harshad Doshi, Pratik Khalate et al. Modification in Heat Sink Design to Improve its Heat Dissipation Capacity for Current CPU Design. Journal of Energy, Environment & Carbon Credits. 2018; 8(3): 1–7p.