Introduction to Multiphysics Simulation for Integrated PCB Design and Operation AI Environment Analysis on Behalf of EMI/EMC

Abstract

Modern trend of PCB (Print Circuit Boards) designing are highly complex and unpredictable. User requirements make the PCB compact and faster nowadays. To make the PCB compact and faster in nature, multidimensional PCBs are trending nowadays. Although multidimensional PCBs are better in size and speed but also have some irrelevant issues like resonance, crosstalk, power/ground bounce and simultaneous switching noise (SSN). All irrelevant issues are responsible for EMI (Electromagnetic Interference). Electromagnetic analysis of PCB is closely linked to other field of physics including thermodynamics and mechanics. In many cases thermal and mechanical effects are inseparable to electric and magnetic effects, like” A high-power filter heats up when in use and it causes thermal deformation that affects the performance of filter”. Such effects pronounced as “intertwined effects” and such effects are also responsible for inducing EM thermal feedback loops inside PCBs. In this paper all irrelevant issues related to PCBs designing in terms of EMI/EMC (Electromagnetic Compatibility) are described and performing various VIA analysis of PCB is also presented.