Open Access Open Access  Restricted Access Subscription or Fee Access

Evolution of Structural Dynamic Modeling Technique for Airborne Chassis

K. Jagadisan, P. Bangaru Babu

Abstract


To estimate random vibration response of airborne chassis finite element method is used as a tool. For making an appropriate requirement to determine the design requirement of the package for a designer the point of accuracy is very much linked to this prophecy. The modeling practices which are used in FEM are linked to attain preciseness in any considered prediction. Preciseness of a particular FE model is inclined with appropriate consideration of material properties and boundary conditions. Two types of chassis have been modeled in test and software to gain more accurateness in comparison with different modifications. The two main challenges in the present investigation are particularly concentrated. For considering material properties conventional method has been established. By the investigation done on FE model the input rotational stiffness has been given to it. Different mounting arrangements have been formed for two chassis which are investigated to find out rotational stiffness and damping values. The two key factors in the investigation include proper assessment of material properties which will give the correct modeling practice for chassis which is genuine in its steadiness. The design appropriateness of chassis in random vibration analysis will make it simpler for any electronic packaging designer

Keywords


Electronic packaging, Finite element analysis of Chassis, Chassis boundary conditions

Full Text:

PDF

References


Marc A. Zampino, Vibration Analysis of an Electronic Enclosure using Finite Element Analysis. Southcon/95. Conference Record, 1995.

Yuntao Chen, Shineng Chen, Wei Ding, Duoyun Xiang, Finite Element Modeling of the Modules in transmitter-receiver, Proceedings of the 2006 IEEE International Conference on Mechatronics and Automation, Luoyang, China, June 25-28, 2006.

Robin Alastair Amy, Guglielmo S. Aglietti, Guy Richardson, Accuracy of simplified printed circuit board finite element models, Microelectr Reliab. 2010; 50: 86–97p.

He Qing, Du Dongmei, Jiang Xuchao, Analysis and Experiment of Dynamic Characteristics of Electronic Device Chassis, J Theor Appl Info Technol. 2013; 48(1): 589–594p.

Aglietti GS, Schwingshackl C. Analysis of Enclosures and Anti Vibration devices for Electronic Equipment for Space Applications. Analysis of enclosures and anti-vibration devices for electronic equipment for space applications. In, Proceedings of the 6th International Conference on Dynamics and Control of Systems and Structures in Space, 2004.

Nicolas Francois, Dynamic Analysis and Launch Qualification of OUFTI-1 Nanosatellite, Sponsored and coordinated by NASA-USA, Faculty of Applied Sciences, Aerospace and Mechanical Engineering Department, University of Liège, 2010.

Jagadisan K, Bangaru Babu P, Anil Kumar P. Precise Modeling Practice For Avionics PCB in Random Vibration Environment, J Exp Appl Mech. STM J. 2016; 7(1): 51–59p.




DOI: https://doi.org/10.37591/joma.v3i3.7247

Refbacks

  • There are currently no refbacks.