A Study on Responses Parameter of EDM Process in EN-353 Steel Using Grey Relational Analysis
DOI:
https://doi.org/10.37591/joma.v2i1.7257Keywords:
EDM, optimization, performance characteristics, GRA, ANOVAAbstract
Electrical discharge machining (EDM) process is the most practically non-conventional machining processes for machining newly developed high strength alloys with high degree of dimensional accuracy and economical cost of production. The last decade has seen an increasing interest in the novel applications of this process, which is particular emphasis on the potential for surface modification. To gain these goals, the consideration is by optimizing the process parameters such as the discharge current (A), pulse-on-time (µs), pulse-off-time (µs) and di-electric fluid (g/l). Now a day, optimization techniques are the new trend for optimization of the machining process parameters. In this paper a multi response optimization method using Taguchi robust design approach is proposed for electrical discharge machining (EDM) operations. Experimentation was planned as per Taguchi’s L9 (33). The responses are namely material removal rate, tool wear rate and last one surface roughness have been optimized with multi response characteristics using grey relational analysis. Analysis of variance (ANOVA) is applied to identify the level of importance of the machining parameters on the multiple performance characteristics considered. Finally, confirmation result was carried out to identify the effectiveness of this proposed method.
References
Lau W.S, Yue T.M, Lee T.C, et al. J Mater Process Techn. 1995; 48: 199p.
Müller F, Monaghan J. et al. Int J Mach Tools Manu. 2000; 40: 1351p.
Crookall J.R, Heuvelman C.J. et al. Ann. CIRP. 1971; 20: 113p.
Huang J.T, Liao Y.S. et al. Int. J. Prodn. Res. 2003; 41: 1707p.
Deng J.L. Introduction to Grey System. J. Grey Syst. 1989; 1: 1p.
Vijian P, Arunachalam V. P. et al. J Mater Process Techn. 2006; 180: 161p.
Ho C.Y, Lin Z C. et al. Int J Adv Manuf Technol. 2003; 21: 10p.
Gopalsamy B. M, Mondal B, Ghosh S. et al. Int J Adv Manuf Technol. 2009; 45: 1068p.
Pawade R. S, Joshi S S. et al. Int J Adv Manuf Technol. 2011; 56: 47p.
Singh P N, Raghukandan K, Pai P C. et al. J Mater Process Tech. 2004; 34: 1658p.
Huang J.T, Lin J.L. et al. Journal of Technology. 2008; 17: 659p.
Dhanabalan S, Siva Kumar. K. et al. Eur J Sci Res. 2011; 68: 297p.
Saha S.K, Choudhury S.K. et al. Int J Mach Tool Manu. 2009; 49: 297p.
Jangra K, Grover S. et al. International Journal of Industrial Engineering Computations. 2011; 2: 479p.
Jangra K, Jain A, Groover S. et al. J Sci Ind Res. 2010; 606p.
Chiang K T, Chang F P. et al. J Mater Process Tech. 2006; 180: 96p.
Tzeng C J, Lin Y H, Yang Y K, Jeng M C. et al. J Mater Process Tech. 2009; 209: 2753p.
Kasdekar D K, Parashar V, Singh J, et al. International Journal of Emerging Technology and Advanced Engineering (IJEAT). 2014; 4: 313p.
Palanikumar K, Karunamoorthy L, Karthikeyan R. et al. J Mater Manuf Process. 2006; 21: 846p.
Kao P.S, Hocheng H. et al. J Mater Process Tech. 2003; 140: 255p.
Fung C.P. et al. Journal of Wear. 2003; 254: 298p.
Lin J.L, Lin C.L. et al. Int J Mach Tool Manu. 2002; 42: 237p.
Dabade U.A. et al. Procedia CIRP. 2013; 7: 299p.
Kuram E, Ozcelik B. et al. Measurement. 2013; 46: 1849p.
Lin C. L, Lin J. L. et al. Int J Adv Manuf Technol. 2002; 19: 271p.
Tosun N. et al. Int J Adv Manuf Technol. 2006; 28: 450p.
Downloads
Published
Issue
Section
License
Declaration and Copyright Transfer Form
(to be completed by authors)
I/ We, the undersigned author(s) of the submitted manuscript, hereby declare, that the above manuscript which is submitted for publication in the STM Journals(s), is not published already in part or whole (except in the form of abstract) in any journal or magazine for private or public circulation, and, is not under consideration of publication elsewhere.
- I/We will not withdraw the manuscript after 1 week of submission as I have read the Author Guidelines and will adhere to the guidelines.
- I/We Author(s ) have niether given nor will give this manuscript elsewhere for publishing after submitting in STM Journal(s).
- I/ We have read the original version of the manuscript and am/ are responsible for the thought contents embodied in it. The work dealt in the manuscript is my/ our own, and my/ our individual contribution to this work is significant enough to qualify for authorship.
- I/We also agree to the authorship of the article in the following order:
Author’s name
1. ________________
2. ________________
3. ________________
4. ________________
| We Author(s) tick this box and would request you to consider it as our signature as we agree to the terms of this Copyright Notice, which will apply to this submission if and when it is published by this journal. |