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Gain Enhanced 2.4 GHz Slotted Rectangular Microstrip Patch Antenna with FR-4 Epoxy Substrate

Ravikiran H.K, J Jayanth, Pooja P, Nayana C S, Shreenidhi MA, Dhruva D B


Applications that use the Internet of Things (IoT) must be combined with wireless networking technologies. This makes it easy to get to the application data. The wireless communication system is a key part of the infrastructure for the Internet of Things. It acts as a bridge for two-way connections to gather data and send control messages. In this work, HFSS software is used to create a rectangular microstrip patch antenna for IoT application with improved gain. For IoT applications, the design is made up of a coaxially fed microstrip patch antenna with slots on the patch and on the ground. Epoxy material FR-4 was employed as the substrate here; it has a dielectric constant of 4.4 and a thickness of 1.6 mm. The ground and patch elements were made out of copper with a thickness of 0.06 mm. The recommended antenna has a gain of up to 5.34 dB, a perfect voltage standing wave ratio (VSWR) of 1.188, and a good fractional bandwidth of 90 Mhz with -24.5996 dB of S11, which makes it function well in IoT applications. The findings of the experiments have been obtained using high-frequency structure simulator software (HFSS) found to be improved when compared to the existing rectangular microstrip patch antenna (RMPA).


High Frequency Structure Simulator (HFSS), Internet of Things (IoT), Microstrip Patch Antenna (MPA), Rectangular microstrip patch antenna (RMPA), voltage standing wave ratio (VSWR)

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