Sputter Deposition of Ni/Ti Thin Film and their Molecular Dynamics

Authors

  • Subas Mishra National Institute of Technology, Rourkela, Odisha, India
  • Ajit Behera National Institute of Technology, Rourkela, Odisha, India

Keywords:

Sputter, molecular dynamics, embedded atomic method (EAM), Ni/Ti multilayer

Abstract

Ni/Ti multilayer fabricated using DC/RF magnetron sputtering technique. Multilayer of Ni/Ti is deposited by alternate deposition of nickel layer and titanium layer, followed by annealing at different temperatures. Annealing treatment is carried out to achieve NiTi SMA thin films. The annealing was accompanied by inter-diffusion, amorphization and precipitation of various intermetallic phases. Classical molecular dynamics simulations have been performed for the atomic diffusion during annealing of Ni/Ti multilayer using embedded atomic method (EAM) interaction potential.

Author Biographies

Subas Mishra, National Institute of Technology, Rourkela, Odisha, India

Department of Metallurgical and Materials Engineering

Ajit Behera, National Institute of Technology, Rourkela, Odisha, India

Department of Metallurgical and Materials Engineering

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Published

2019-04-22

Issue

Vol. 3 No. 2 (2016)

Section

Articles

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