A Compact Review on Physical Vapor Deposition Techniques of Thin Films

Authors

  • Muhammad Muzammil Department of Chemical Engineering,
  • Sarah Farrukh Department of Chemical Engineering
  • Aftab Akram Department of Chemical Engineering

Keywords:

Thin film, Physical Vapor Deposition (PVD), Evaporation, Sputtering.

Abstract

The effectiveness and performance of a material is greatly influenced by its surface properties. It is possible to manipulate and alter these surface characteristics to satisfy the particular characteristics for better results. One way of modifying these properties is by coating that particular surface with thin film. There exist wide number of methodologies for coating a surface or depositing thin films over it. These techniques can be categorized either as physical or chemical depositions methods. An overview of different physical deposition techniques for fabrication of thin film, as per existing literature, has been given in this article. The ‘Evaporation’ and ‘Sputtering’ techniques, being the two major classes of Physical Vapor Deposition (PVD), are discussed briefly.

Author Biographies

  • Muhammad Muzammil, Department of Chemical Engineering,
    School of Chemical and Materials Engineering, National University of Sciences and Technology, Islamabad, Pakistan
  • Sarah Farrukh, Department of Chemical Engineering
    School of Chemical and Materials Engineering, National University of Sciences and Technology, Islamabad, Pakistan
  • Aftab Akram, Department of Chemical Engineering
    School of Chemical and Materials Engineering, National University of Sciences and Technology, Islamabad, Pakistan

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Published

2019-09-03

Issue

Vol. 6 No. 2 (2019)

Section

Articles

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