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Experimentally New Technique System to Measure Contact Angle of Metal/Melt System in Simple Way

Akram Jassim Jawad, Mohammed H AL-Mamori


In this research, easy and new technique system to measure contact angle of metals/metals system
was introduced. The new technique system used a simple component in direct procedure to found
contact angle of solder on metals substrate in wide range of drops volumes. Solder was applied into
aluminum and copper substrate metals using control heating temperature of the substrate. Then, the
results were analyzed by image J program to know the accuracy of the system. The results showed
interesting difference contact angles values between standard and measured samples, for solder/Cu
was about (-1.8) degree, while for solder/Al was about (-1.2) degree. Also, standard deviations of the
experimental measurements were for solder/Cu around (3.7) and for solder/Al around (5.3),
respectively. That means this system has interesting ability to measure contact angles of metal/metal
system, especially solder/metal system.


Aluminum, contact angle, cupper, ImageJ Program, metal melt, solder

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