Micro-Stream Jetting Effect of Acoustic Cavitation during Sono-Electroplating of Thin Films: A Morphological Note

Abstract

In this study, copper thin films were electroplated onto laboratory grade aluminum substrate in presence of ultrasound and were then subsequently characterized by scanning electron microscopy. The macroscopic appearance reveals that the surface of the films had micron sized crater like holes. An initial analysis may direct to conclude that the hydrogen evolution might have caused so. However, microscopic examination on hole morphology, the nature of the flow of materials causing the copper holes and presence of stressed region may support the author's arguments to support the hypothesis as presented in the article.