Open Access Open Access  Restricted Access Subscription or Fee Access

Design and Structural Analysis of Ground Electronic Package

Rajan Chavda, Sarang Pande, Anurag Verma

Abstract


Electronic packaging (EP) is widely used for support and enclosure or housing of electronic component. This paper includes design of EP and comparisons of analytic and static structural analysis for deformation of EP. Design of EP is carried by commercial software PTC Creo Parametric 2.0. It consists of five main parts and some other additional parts and to run the analysis. The design includes mounting of electronic circuits; improving testing capability and reliability, a way for heat dissipation and reducing manufacturing cost and time. Finite element analysis (FEA) of EP has been carried out using ANSYS workbench 15.0 software. Two types of latches (Product of Southco Company Ltd.) are used in EP for easy movement of tray (EP) in cage. Mechanisms of latch are push to open and push to close. These mechanisms are used for easy visual inspection on solder side and component side. E4 latch and A4 latch are respectively plastic latch and metal latch. Force is required for latching and due to this force, package is deformed. Fixed supports that have been considered at the different faces, where bolts have been attached and loading conditions have carried by latch force. Comparison of free body analysis and software simulation has been carried out.

Cite this Article
Rajan Chavda, Sarang Pande, Anurag Verma. Design and Structural Analysis of Ground Electronic Package. Journal of Production Research and Management. 2017; 7(2): 8–16p.


Full Text:

PDF

References


Ed. Blackwell, Glenn R. The Electronic Packaging Handbook. CRC Press; 2000; 11p.

Liu C, Pecht MG, Scalise JA. Electronic Packages: Quality and Reliability. Encyclopaedia of Materials: Science and Technology, Elsevier; 2001; 2644–2654p.

John S, Clapper Randy S, Wade Raymond P. Design and Development of a CPCI-Based Electronics Package for Space Station Experiments. Ohio: NASA, John Glenn Research Centre; May 2006.

Guidelines for Packaging Design of Electronic Equipment for Ground Hardware. Ahmedabad: Quality Assurance Mechanical Division, SAC; Mar 1994.

Barucci M, et al. Aluminium Alloys for Space Applications, Low Temperature Thermal Conductivity of AL6061T6 and A1050. Proceedings of the 8th Conference of Astroparticle, Particle and Space Physics. Defectors and Medical Physics Applications. Como, Italy; Oct 6–11, 2003; Como, Italy: World Scientific Publishing Co. Pvt. Ltd.; 2004; 541–545p.

ITT India: ITT Corporation. Www.ittindia.in. Aug 2016. [Cited 2016 Sep 10]. Available from:

https://www.ittcannon.com/Core/medialibrary/ITTCannon/website/Literature/Markets/Space.pdf?ext=.pdf

Southco India Private Limited. www.southco.com. [Cited 2016 Dec 31] Available from:

https://www.southco.com/static/Literature/a4.en.pdf

https://www.southco.com/static/Literature/e4-t.en.pdf

James MG, Barry JG. Strength of Material. Cengage Learning. Global Engineering: Christopher M. Shortt; 2012.

ANSYS Mechanical APDL Structural Analysis Guide. [Cited 2016 Dec 25] Available from: http://148.204.81.206/Ansys/150/ANSYS%20Mechanical%20APDL%20Structural%20Analysis%20Guide.pdf, Feb 2017.

Bhanadari VB. Machine Design Data Book. McGraw Hill Education (India) Pvt. Ltd.; 2014.




DOI: https://doi.org/10.37591/joprm.v7i2.3716

Refbacks

  • There are currently no refbacks.